AlSiC, and AlSiC Hybrid Composites for Flip Chips, Optoelectronics, Power, and High Brightness LED Thermal Management Solutions

Abstract

Aluminum silicon carbide (AlSiC) metal matrix composites (MMC) are providing thermal management solutions for numerous electronics applications today for improved reliability including flip chip lids, optoelectronics packaging, power devices and high brightness LED applications. AlSiC has a high thermal conductivity (200 W/mK) and thermal expansion coefficient (TCE) values that are compatible with materials that are used in electronic assemblies. AlSiC also has high strength and high stiffness that is similar to steel at a third the weight. Integration of materials and functional components to AlSiC can be accomplished during the net-shape casting fabrication for low-cost assembly and integration. AlSiC and can be integrated with high heat dissipation materials such as thermal pyrolytic graphite (TPG), or CVD diamond to from hybrid composite structures for application that require very high heat dissipation. AlSiC composite package fabrication process provides the most cost effective means to integrate these high heat dissipation materials into an electronic packaging assembly as discussed. This paper explores the thermal management solutions provided by AlSiC and AlSiC hybrid composite products. Performance and reliability were discussed for various applications. Thermal dissipation performance was illustrated using thermal modeling of currently produced product