Abstract
Abstract The gate dielectrics for silicon carbide based MOS devices are still crucial for their performance and reliability. Conventional thermal oxides have a poor interface quality and a low dielectric constant. To mitigate the issues brought about by conventional thermal oxidation, Al(ON) based on atomic layer deposition (ALD) technique is proposed and studied in terms of interface state density and dielectric strength/reliability. To make comparison, the results of AlN and Al2O3 grown using the same ALD technique, are included as well. It is shown that by incorporating of nitrogen/AlN, Al(ON) can reduce interface state density and border trap density. In addition, its dielectric strength/reliability in terms of time-zero-dielectric breakdown (TZDB) also improves.
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