Abstract
We show that a Cu–Ni alloy film of arbitrary composition may be grown by electrodepositing well-defined submonolayer quantities of Cu and Ni in alternation. Active computer control of the deposition process is used to compensate for undesired electrochemical processes, such as partial redissolution of the Ni. Magnetic measurements were used to characterize alloy homogeneity. With this electrodeposition method it is possible to tailor the composition profile of a film with subnanometer precision. As an example, Cu0.19Ni0.81/Cu0.79Ni0.21 alloy/alloy multilayers were fabricated which gave prominent satellite peaks in high angle x-ray diffraction patterns.
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