Abstract

Development of polymer-based composites with simultaneously high thermal conductivity and breakdown strength has attracted considerable attention owing to their important applications in both electronic and electric industries. In this work, boron nitride (BN) nanofibers (BNNF) are successfully prepared as fillers, which are used for epoxy composites. In addition, the BNNF in epoxy composites are aligned by using a film casting method. The composites show enhanced thermal conductivity and dielectric breakdown strength. For instance, after doping with BNNF of 2 wt%, the thermal conductivity of composites increased by 36.4% in comparison with that of the epoxy matrix. Meanwhile, the breakdown strength of the composite with 1 wt% BNNF is 122.9 kV/mm, which increased by 6.8% more than that of neat epoxy (115.1 kV/mm). Moreover, the composites have maintained a low dielectric constant and alternating current conductivity among the range of full frequency, and show a higher thermal decomposition temperature and glass-transition temperature. The composites with aligning BNNF have wide application prospects in electronic packaging material and printed circuit boards.

Highlights

  • In recent years, to achieve a better performance, the tendency in electronic technology has been towards integrating more transistors into a single chip

  • The reasons can be ascribed to the high intrinsic resistance of boron nitride nanofibers (BNNF) and the interface layer between polymer and fillers according to the core-shell theory [9], which blocks the direct transfer of free charge carriers and prolongs the transport path of carriers in the epoxy matrix

  • The addition of BNNF to the epoxy composites has no obvious effect on the dielectric permittivity of epoxy

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Summary

Introduction

To achieve a better performance, the tendency in electronic technology has been towards integrating more transistors into a single chip. In the field of electrical insulation, inorganic particles with high intrinsic thermal conductivity and desirable insulating properties are considered more as fillers of composites, such as alumina (Al2O3), aluminum nitride (AlN) and boron nitride (BN) [2,8,12,13,14]. The electrospinning method has attracted more and more attention due to its many advantages, such as easy preparation technology, high-yield nanomaterials and regular structure of nanofibers for energy storage and thermal management materials [27,28,29,30]. The orientation-BN nanofiber/Epoxy composite film with increasing breakdown strength and thermal conductivity is developed. The thermal performance of the products has been evaluated, including thermal conductivity, thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC)

Material
Preparation of BNNF
Preparation of Epoxy-based Nanocomposites Film
Characterization
Results and Discussion
Dielectric and Thermal Properties
Thermal Conductivity
Conclusions
Full Text
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