Algorithms for coupled transient simulation of circuits and complicated 3D packaging : LUIS MIGUEL SILVEIRA, MATTAN KAMON and JACOB WHITE. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 92 (February 1995)

Abstract

In keeping with our theme of ASICs and packaging, this Guest Editorial from Keith Gurnett ponders the evolution of two of industry's current darlings: chipsets and MCMs (multi-chip modules). Are these a clever market ploy to enable the chip sellers to add value? Do they cramp the designer's style instead of conferring more versitility? Most of all, are chip sets just another evolutionary step towards the MCM? Ultimately, will MCMs evolve into ASICs? The questions and the technology options continue to multiply.