Abstract
We have successfully fabricated an AlGaN/GaN high-electron-mobility transistor with a distributed gate (DG-HEMT) on a stripe-patterned Si substrate. With the help of the stripe pattern, GaN film with low defect density could be deposited by two-step growth. The striped AlGaN/GaN structure could be obtained naturally by stopping the epitaxy process before coalescence. The DG-HEMT fabricated on the striped pattern layout shows good performance. The output characteristics were enhanced from 297 to 337 mA/mm, because the high quality of GaN grown on the patterned substrate can reduce the number of defects. In addition, the drain current was not decreased because the heat problem was reduced in the DG structure.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.