Abstract
AbstractAlGaN is an important material for ultra‐violet light emitters, photo detectors and high breakdown voltage switching devices. In this work, crack‐free AlxGa1‐xN (5% < x < 55%) layers up to 1.5 μm have been grown on 4 inch Si(111) using an AlN/AlyGa1‐yN (y > 70%) template. The structural quality of AlGaN layers is comparable to that of GaN layers grown on silicon(111). For Al0.16Ga0.84N, the FWHM of HR‐XRD (0002) and (‐1102) ω‐scan is around 650 arc sec and 1200 arc sec respectively. Based on this high quality AlGaN buffer, a double heterostructure (DH) FET was demonstrated. The sheet resistance of DH‐FET is 274 ± 4.7 Ω/□ and the uniformity value of 1.7% is also excellent. Some of the wafers have been processed. Devices with a gate length of 2 μm showed current density of 500 mA/mm and transconductance of more than 200 mS/mm. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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