Abstract
The relationship between the properties of Al thin film sputter-deposited on large glass substrate (550×650 mm) and the sputtering process parameters were clearly identified by means of Taguchi methods. The number of magnet passes, the substrate temperature, and the Ar pressure have significant effects on the microstructure of Al thin film. Taguchi methods contribute to the optimization of the sputtering process by reducing the number of test trials from 324 to 18. The results indicate good agreement between the properties of the simulated and actual sputter-deposited Al film.
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