Al と Cu の傾角粒界とねじり粒界の安定性と界面結合の第一原理計算

Abstract

The stability and interfacial bonding of coincidence tilt and twist grain boundaries (GBs) in Al and Cu have been examined by using the projector-augmented wave method within the density-functional theory. For the {221} Σ=9 tilt GB, glide models are more stable than mirror models for Al and Cu, and the {001} Σ=5 twist GBs are more stable than the Σ=9 tilt GBs for Al and Cu, due to smaller structural distortions. There is a tendency that the boundary energies in Al are substantially smaller than those in Cu. This can be explained by the electronic and atomic behavior of bond reconstruction at the interfaces in Al, due to the covalent nature of Al as observed in the charge density distribution, in contrast to rather simple metallic bonding at Cu GBs. The nature of GBs is discussed with respect to the micro-structural evolution and mechanical properties of metallic micro-crystalline formed by severe plastic deformation.