Al and Ti/Al contacts on n-GaN

Abstract

Al(60 nm) and Ti(40 nm)/Al(160 nm) metal layers have been deposited by thermal evaporation onto n-GaN epitaxial layers grown by metal organic chemical vapour deposition (MOCVD) on a c-plane sapphire substrate. The samples have been annealed at 300, 400, 700 or 900 °C for 10 min in vacuum. The microstructural and electrical properties of the contacts have been investigated by electron microscopy, X-ray diffraction and by current–voltage measurements. As-deposited Al and Ti/Al contacts were rectifying with Schottky barrier heights below 0.35 eV and 0.38 eV, respectively. After heat treatment at 300 °C and 400 °C both contacts exhibited linear current–voltage characteristics. After annealing at 700 °C Al contacts became rectifying with a barrier height of 0.42 eV, while Ti/Al contacts remained nearly linear at the same temperature. The electrical characteristics and XRD analysis indicated that the upper metal in Ti/Al contact diffused in the Ti layer already during deposition. Cross-sectional transmission electron microscopy revealed that in the case of Ti/Al contacts, the continuity of the Ti layers ceased when annealing above 700 °C. X-ray diffractions showed, that a Ti 2N interface phase formed in Ti/Al contacts at 700 and 900 °C, and an AlN interface phase developed in the same contact at 900 °C.