Abstract

A low cost, high reliability accelerometer microsystem designed for crash sensing in automotive airbag electronic control units is presented. The proposed microsystem offers high level output, on-line self-test function, small size (3.5 mm × 3.5 mm × 1.15 mm), and high design flexibility thanks to a two-chip construction. The sensitive part is a surface micromachined capacitive interdigitated structure realized from a SIMOX SOI substrate. The accelerometer operates in a closed loop mode using electrostatic feedback with conditioning circuitry realized in a 2 μm CMOS process. A high performance readout circuit using switched capacitors has been developed. Behavioural simulation results show a bandwidth of 630 Hz at ±50g with 5 V power supply. The fabrication process includes the realization of a free-standing seismic mass by means of reactive ion etching and sacrificial oxide etching, the mechanical protection of the sensing element with a thin silicon cap bonded onto the structured SOI wafer, and eventually the electrical connection with the ASIC by flip-chip bonding. Preliminary results are very encouraging: dynamic actuation of the sensing elements is optically tested, with a yield of 70% at a prototype level. Excellent shock resistance and low internal stress are observed.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.