Air Cooling Module Applications to Consumer-Electronic Products

Abstract

The purpose of this chapter is to describe how a air-cooling thermal module is comprised with single heat sink, two-phase flow heat transfer modules with high heat transfer efficiency, to effectively reduce the temperature of consumer-electronic products as Personal Computer (PC), Note Book (NB), Server including central processing unit (CPU) and graphic processing unit (GPU), and LED lighting lamp of smaller area and higher power. The research design concentrates on several air-cooling thermal modules. For air cooling, the extended surface, such as fin is usually added to increase the rate of heat removal. The heat capacity from heat source conducted and transferred through heat sink to the surroundings by air convection. Thus, the aim of adding fin is to help dissipate heat flow from heat source. The air convection heat transfer mechanism was shown in the figure 1, which can be separated into forced and free/nature convection through dynamic fluid device as fan. The chapter is divided into three parts; first part discusses optimum, performance analysis and verification of a practical convention parallel plate-fin heat sink. Second part employs two-phase flow heat transfer devices, such as heat pipe, thermosyphon and vapor chamber comprised with heat sink to consumer-electronic products. The last part utilizes air-cooling thermal module in other industrial areas including injection mold and large motor. A conventional plate-fin heat sink is composed of a plate-fin heat sink and a fan. Thermal resistance network is often employed to analyze the thermal model and system in the industry. The overall thermal resistance includes interface resistance, base-conduction resistance, and convective resistance. It is worth developing a model for a conventional aircooling device that takes heat sink configuration and airflow conditions into account in order to predict the device’s thermal performance when developing laminar-, transition-, and turbulent-flow regimes. Although, solving the high heat capacity of electronic components has been to install a heat sink with a fan directly on the heat source, removing the heat through forced convection. Increasing the fin surface and fan speed are two direct heat removal heat sink in order to solve the ever increasing high heat flux generated by heat source from consumer-electronic products. They can reduce the total thermal resistance from 0.6 °C/W to 0.3 °C/W. Lin & Chen (2003) and Wu et al. (2011) has been developed an analytical all-in-one asymptotic model to predict the hydraulic and thermal performance of