Abstract
With the development trend of connectors to high-current and high-temperature service, copper alloy connectors are required to have superior stress relaxation resistance. In this work, the optimal aging parameter was explored via stress relaxation resistance, strength, microhardness, and conductivity. And the strengthening mechanism of stress relaxation was investigated through the TEM and EBSD microscopic characterization. The results show that the Cu–Cr–Ni alloy reached the peak aging state under 450 °C for 1 h and obtained excellent properties. Especially, the percentage of residual stress in the relaxation test reached 93.1%. The microhardness associated with aging strengthening showed a positive correlation with yield strength and stress relaxation resistance. Then the microhardness after aging can be used as a simple evaluation index of stress relaxation resistance. The Cu–Cr–Ni alloy with superior stress relaxation resistance is mainly related to dislocation strengthening, second phase strengthening, and the coexistence of spinodal decomposition and ordering.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
