Abstract
The solid-state diffusion behavior in the layered Cu–Sn/Cu intermetallic phase system was investigated by using Cu–20 wt.% Nb (filament)/Sn diffusion couple at 400–450°C. Very thin Nb filament is used as an inert marker for studying the Kirkendall effect-like phenomena. Experimental results show that the Nb filaments near the interface of Cu–Nb/Sn are shifting toward the Cu–Nb side and forming a Nb filament aggregating zone with the concentration of Nb up to 27–40 wt.% and a width about 10–15 μm. The study proved that the shift of Nb filament originated from volume expansion caused by the formation of ε phase (Cu 3Sn). The convoluting or coarsening of ribbon-like Nb filament resulting from stress relaxation during annealing plays a role of driving force for the aggregation of Nb, making the density of Nb filaments in the aggregating zone dependent on temperature.
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