Abstract
In this paper we present a comparative study of the agglomeration process in silicon-on-insulator (SOI), silicon germanium-om-insulator (SGOI), and strained SOI (SSOI) thin layers under thermal annealing in ultrahigh vacuum. In particular, we provide the first evidence and characterization of agglomeration in SGOI and SSOI substrates. A common agglomeration dynamics is observed in all the substrates investigated, with the semiconductor-on-insulator layer thickness being the main parameter governing it. These findings provide a better understanding of the surface-energy-driven dewetting phenomenon in semiconductor layers and allow us to single out the influence of the surface and stress energies on the void formation and evolution, as well as on the size and density of the agglomerated islands.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
