Abstract

Ag wire and Ag alloy wire reliability experiments were conducted on both 28-lead SOP and 96-pin PBGA packages. Biased HAST (b-HAST) of Ag-wired packages with higher ion content molding compouds generated obvious defects promoted by ion accumulation mechanism. Intermetallic compounds (IMCs) at the corroded interface are identified using cross-sectional TEM/EDX. Ion selective affinity of intermetallic compound is rationalized using ab initio molecular dynamics simulation.

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