Abstract
Ag sintering as interconnection technology for first level interconnects has made its way to production. For example, in order to join power semiconductors or LEDs. But what about extending the application field to use this technology for large area joining. For instance, replacing thermal grease by a sintered Ag joint between a power module and a baseplate. In order to evaluate if it is feasible to generate a sintered Ag joint of 900 mm2 tests were conducted by mounting Cu sheets on AlMg3 sheets by pressureless and pressure assisted Ag sintering. The reliability of such large area interconnects was tested by thermal cycling between -55 °C and +125 °C.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
