Abstract
In this study, Cu/Ag/polydopamine (PDA)/polyester (PET) fabrics were fabricated for multi-functional textiles. The PET fabrics were firstly modified by dopamine to form a polydopamine (PDA) layer on the fiber surface, then Ag nanoparticles (Ag NPs) were anchored on fiber surface through chelation between PDA and Ag+ ions, and the Ag NPs were further used as catalytic seeds for in situ reduction of Cu nanoparticles (Cu NPs). The surface morphology, chemistry, and crystalline structure of the prepared PET fabrics were characterized by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), and X-ray diffraction (XRD). As expected, Cu NPs were evenly dispersed on the surface of fibers. The Cu/Ag/PDA/PET fabrics showed good antibacterial property against Escherichia coli and exhibited excellent electromagnetic interference (EMI) shielding ability. The Cu/Ag/PDA/PET fabrics with high performance antibacterial and EMI shielding properties can be applied as functional protective textiles.
Highlights
Surface metallization endows textiles with a variety of functions, such as antibacterial, anti-ultraviolet, conductive, and electromagnetic shielding performance [1,2,3,4]
PDA/PET fabrics becomes rough with many nanoparticles located on the surface of fibers
PET to fabrics have poor antibacterial little bacteria exist on the culture dish for Cu/Ag/PDA/PET fabrics, and a 99.2% reduction has found in bacterial loading against Escherichia coli (Figure 11b)
Summary
Surface metallization endows textiles with a variety of functions, such as antibacterial, anti-ultraviolet, conductive, and electromagnetic shielding performance [1,2,3,4]. Chemical plating is a commonly adopted approach to metallize textiles, and the process of which includes desizing, roughening, sensitization, activation, and deposition [5,6,7]. Stannous chloride (SnCl2 ) is generally used to form gel on fabric surface to reduce the activator palladium chloride (PdCl2 ), the noble metal catalytic is formed on the surface of the fabric, the activation energy of metal deposition during chemical plating process is reduced, leading to increased metal deposition rate. Traditional chemical plating process is complicated, and the involved SnCl2 and PdCl2 can cause environmental pollution due to their toxic nature [8,9]. It is still challenging to develop a simple method of chemical metal plating on fabric surface with high fastness
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