Abstract
A new style of forming Ag back electrode for organic solar cells (OSCs) using a bonding process was compared with a conventional screen-printed Ag. All the fabrication process steps have been conducted under atmospheric conditions at room temperature without using a glove box. The OSCs with both screen-printed and bonded Ag back electrode exhibited comparable performances with the average power conversion efficiencies of 1.28% and 1.31%, respectively. The series and the shunt resistance values for the OSC with the bonded Ag were slightly better than those with the screen printed Ag. The binder resin at the interface between the PEDOT:PSS and the Ag may increase contact resistance for the screen-printed Ag process, while that between the Ag and the PET film for the bonded Ag process may not increase it. The bonding process for the Ag back electrode has the potential for future electronic device applications.
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