Abstract
The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without <TEX>$Bi_2O_3$</TEX>) and HBF-B(with <TEX>$Bi_2O_3$</TEX>) were made from <TEX>$SiO_2$</TEX>, <TEX>$B_2O_3$</TEX>, <TEX>$Al_2O_3$</TEX>, CaO, MgO, <TEX>$Na_2O$</TEX>, <TEX>$K_2O$</TEX>, ZnO, MnO, <TEX>$ZrO_2$</TEX>, <TEX>$Bi_2O_3$</TEX>. And Ag based conductor pastes and <TEX>$RuO_2$</TEX> based resistor paste were prepared by mixed with these frits and functional phase(Ag and <TEX>$RuO_2$</TEX>), and organic vehicle. The properties of thick film conductor and resistor sintered at <TEX>$850^{\circ}C$</TEX> were studied after printing on <TEX>$Al_2O_3$</TEX> substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of the Korean Institute of Electrical and Electronic Material Engineers
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
