Abstract
The thermal characterization capabilities of an AFM have been applied to a fragile bulk micromachined device, showing its advantages over other contact and non-contact thermal probing techniques. This technique has proved its suitability to obtain very spatially accurate temperature distribution of this kind of devices. This thermal information has been obtained for a micromachined thermopile designed for gas sensing purposes. In this way, a good understanding of the thermoelectrical response of this device has been obtained, allowing to analyze the thermal effect of the geometric design parameters and helping to their optimization.
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