Abstract
In this paper, the advantage of TSOP with copper leads is shown by comparing: (1) the calculated stress and strain in the solder joints with that of the TSOP with Alloy 42 lead frames (Lau et al., 1992), and (2) the experimental thermal life distribution with that of the TSOP with Alloy 42 leads (Lau et al., 1993). The disadvantage of TSOP with copper leads is shown by considering the technology limitations and manufacturing constraints.
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