Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (Adv. Mater. 52/2022)

Abstract

Capillary Underfill Materials Underfill materials with high thermal conductivity play crucial roles in ensuring the reliability and performance of microelectronic devices with ever-increasing power density. In article number 2201023, Xiaolin Xie, Yiu-Wing Mai, and co-workers review the state-of-the-art advances on capillary underfill materials and give future perspectives for designing high-performance underfill materials with novel microstructures.