Abstract
The semiconductor industry is in a constant state of evolution, driven by the relentless pursuit of improved performance, enhanced efficiency, and the ever-decreasing size of electronic devices. A critical aspect of this advancement is the development of ultra-short pitch system-on-chips (SoCs). These SoCs, characterized by their densely packed connections and minimal spacing between contact points, present unique challenges during wafer probing—a crucial step in semiconductor manufacturing. This article delves into the complexities of wafer testing for short pitch SoCs, explores the latest innovations in this domain, and discusses how these advancements are revolutionizing semiconductor manufacturing processes.
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