Advances in vapor-liquid phase change for thermal management

Abstract

Given the developments in microelectronics, materials, and renewable energy, current devices are becoming increasingly miniaturized and integrated, increasing the heat generated during high-power operation. The addition of microscale flow channels through which coolant flows to the bottoms of such devices effectively removes heat. During this process, liquid-vapor phase change can occur, specifically pool and flow boiling. These processes play significant roles in thermal management and have been extensively studied for decades. Thus, in this chapter, advances in vapor-liquid phase changes for thermal management are briefly reviewed in terms of the fundamental theories and concepts, multiscale numerical simulation methods, experimental investigations, and future prospects.