Abstract

Thermal interface materials (TIMs) serve a critical function in light-emitting diode (LED) assemblies and electronic systems, although the cost of some is very modest. The basic function is to provide an effective thermal path between two dissimilar surfaces, often the base of the LED array and a heat sink or a metal heat-dissipating surface. The TIM material in the simplest definition is intended to reduce air gaps between mating metal surfaces, given the very poor thermal conductivity of air. Proper selection and application of a TIM will compensate for relative surface roughness and surface imperfections on one or both mating surfaces that create loss of surface-to-surface contact for the transmission of heat.

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