Abstract
The surface passivation properties of aluminium oxide (Al2O3) on crystalline Si are compared with the traditional passivation system of silicon nitride (SiNx). It is shown that Al2O3 has fundamental advantages over SiNx when applied to the rear of p-type silicon solar cells as well as to the p+ emitter of n-type silicon solar cells. Special emphasis is paid to the transfer of Al2O3 into industrial solar cell production. We compare different Al2O3 deposition techniques suitable for mass production such as ultrafast spatial atomic layer deposition, inline plasma-enhanced chemical vapour deposition and reactive sputtering. Finally, we review the most recent cell results with Al2O3 passivation and give a brief outlook on the future prospects of Al2O3 in silicon solar cell production.
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