Abstract
The realization of optoelectronic integrated circuits (OEICs) and photonic integrated circuits (PICs)—single semiconductor chips on which large numbers of both electrical and optical components are integrated—draws on many material-related technologies. Future progress on complex OEICs and PICs depends critically on continuing advances in III–V material synthesis, especially the vapor and beam forms of epitaxy, and on a wide variety of material processing techniques.
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