Abstract
This paper presents phased-array efforts at X to Ka-band based on highly-integrated silicon core chips. The work shows that it is possible to build advanced phased-arrays using SiGe chips at each antenna element. The phased-array is constructed on a single printed-circuit board which reduces the cost by a factor of 10x. This will revolutionize X, Ku and Ka-band phased arrays by making them the preferred choice for 5G, SATCOM and point-to-point applications.
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