Advances in hollow-core to standard fiber interconnection technology

Abstract

The attenuation of hollow-core fibers (HCFs) is predicted to surpass the minimum intrinsic attenuation of standard single-mode fibers (SMFs) in the near future. Recent advances in HCF performance and drawing technology have motivated their application not only in telecommunications but also in sensing and high-power delivery. Among HCFs, nested antiresonant nodeless fibers (NANFs) have shown the lowest attenuation values with 0.28 dB/km at 1550 nm and 0.22 dB/km at 1625 nm. Furthermore, the latest generation of NANFs effectively mitigates higher-order modes, which in some applications introduces a significantly limiting factor. As HCFs are becoming more available, their incorporation into standard SMF-based systems needs to be efficiently addressed. Various solutions to the HCF-SMF interconnection have already been proposed, such as the commonly employed fusion splicing with bridge fibers, using tapers to match the mode-fields, employing micro-optics, or using the fiber-array approach. Based on the fiber-array approach we have recently demonstrated losses of only 0.16 dB per interconnection and back reflection below -60 dB. But what if the interconnection itself can provide some additional functionality beyond low loss and low back reflection? Such an approach was already proposed in the micro-optics interconnection providing a function as an optical isolator or a wavelength-division multiplexer. Still, the relatively high complexity of such a device might limit its wider application. In this talk, I will overview current trends in HCF-SMF interconnection techniques which are enabling their incorporation into current SMF-based fiber-optic systems. I will present a future outlook of providing additional functionality to the HCF-SMF interconnection. I will focus on an interconnection technique we developed, based on the fiber-array approach. I will show how components such as an optical filter, a gas cell, or a Fabry-Perot cavity can be easily formed by simple tailoring of the HCF-SMF interconnection.