Advancements in motor drive modules, past, present, and future

Abstract

Manufacturers are realizing the advantages that modules offer over discrete solutions in motor drive systems. As new product replaces the old, the next generation of modules provide advanced packaging techniques, improved performance, smaller size, and reduced cost. This paper compares two generations of motor drive modules to show the advancements made as technology progresses and customer feedback drives the product package. Although the new package can fit a variety of power applications, the specific application addressed is a 1 HP, three phase, induction motor from a three phase 230 V line. The work profiles performance gains realized by using new generations of IGBTs and free wheeling diodes. Total system solution toolkits that provide testbeds for evaluating power component performance and for displaying motor control electronics in both the three phase induction motor and DC motor applications are introduced. Future trends in module products conclude the discussion. New materials in packaging (direct bond copper and metal matrix composite) and semiconductors (GaAs and SiC) constitute the majority of the discussion about future trends. This presentation is geared to benefit engineers of all levels, from those with little or no electronics knowledge to advanced programmers of drive systems. This strategy is in line with the current trend in transitioning motors, and the engineers that design them into adjustable speed drives.