Abstract
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs. This paper discusses the current state-of-art TIM solutions, particularly fusible particles for improved thermal conductivity. The paper will address the benefits and limitations of this approach, and describe a system with unique filler morphology. Thermal resistance and diffusivity/conductivity characterization techniques are also discussed.
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