Abstract

For high performance IR imaging and seeker systems AIM has established a high yield and reproducible HgCdTe detector technology. For continuous improvement of detector performance, yield and reliability, key processes have been optimized and new approaches have been developed. By a superior CdZnTe Bridgman growth process, dislocation densities < 1×10 5 cm −2 in substrate and epitaxial layer are achieved for all substrates, ensuring high performance focal-plane-arrays, particularly for λ CO =11.5 μ m arrays. A new guard ring approach for planar diodes, created by a n +-region in pixel spacing area reduces pixel crosstalk and improves modulation transfer function. For long linear arrays, a multichip-module-technique has been developed, which meets the demands for high temperature-cycle-reliability. In addition, a cycle-to-failure model has been established by cooldown tests on AIM-FPA's to predict cycle-to-failure at existing FPA approach or maximum allowable strain at demanded cycles-to-failure specification.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.