Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays

Abstract

Abstract In this paper we present an optimized manufacturing technique for special long-wavelength 1-dimensional and 2-dimensional Vertical Cavity Surface Emitting Laser Diode (VCSEL) arrays with focus on die bonding and a special wire bonding process as well as additional possibilities to make the manufacturing more productive and to increase the product quality, reliability, and life time. VCSEL arrays have a very broad application potential. Objective of this paper is the development of an assembly technology for long-wavelength VCSEL arrays with high positioning accuracy for automated production with high total yield, using gold-based conductive glue (because silver migration is a concern) securing high yield and extremely high reliability and lifetime. Due to special customer requirements, a final thickness of the conductive glue of 35 micron with low standard deviation is necessary. For highest reliability, gold wire bonding of the top side contact of the VCSEL to a silicon substrate with gold metallization has been a customer requirement. With the described technique we develop and produce customer specific products with dedicated wavelength, performance, and packaging options. Bases on our findings, very flexible and scalable solutions are possible, matching many different applications. Finally, we will present an overview of our results on the physical and electro-optical characterization of the VCSEL devices. This yielded a very productive manufacturing technique, meeting the requirements mentioned above. Special design features of the VCSEL ensure that the relatively high thermal resistance of the cured conductive glue layer does not impair the electro-optical properties or the lifetime of the VCSELs. For the interconnection of the top side contact we used gold wire with 20 microns diameter, using ball-wedge, Stand-Off Stich Bond process with special loop geometry, required by the customer. Due to the properties of the semiconductor material of the VCSELs a low bonding temperature is required, enabled by our special wire bonding process. Gold wire bonding delivered excellent results, by far exceeding the customer specification. The optical spectrum of the VCSELs and other measurements indicate that the assembly processes do not harm the laser diodes or their electro-optical properties. All customer requirements for the 1-dimensional and 2-dimensional VCSEL arrays have been met. The electro-optical and burn-in data furnished proof of the quality of the engineered assembly technology. The technologies developed for low current as well as high current laser arrays will enable new devices for a huge amount of new applications because of the novel manufacturing processes as well as innovative packaging of the VCSEL arrays.