Advanced Packaging Solution to Hermetically Packaging Microelectronic Devices

Abstract

Hermetic sealing microelectronic devices in package become more and more of a challenge for manufacturers due to the complexity of thermal management, getter integration, and material selection and interactions. Such complexity drives the original equipment manufacturer (OEM) to deliver the equipment and technology to meet manufacturers' requirements. This study has successfully demonstrated that a vacuum reflow technology is able to deliver packages with an excellent hermetic seal. The measured leak rates of these two package types are about two orders of magnitude better than the requirement by Mil-Std 883 method 1014 specification. The result is clear that optimization of the force applied to the lid and package during seal process is essential and the force density of 5 kPa is able to produce a great hermeticity for the two packages under study. A good solder joint strength is essential to deliver a package with hermeticity but is not enough, while a weak joint strength is not possible to achieve hermeticity.