Advanced Multilayer Thick-Film System-on-Package Technology for Miniaturized and High Performance CPW Microwave Passive Components

Abstract

This paper presents advanced multilayer (ML) thick film system-on-package (SOP) technology for realization of ceramic-based embedded coplanar waveguide (CPW) inductors and capacitors library with remarkably high performance and miniaturization. The detailed characterization and modeling of CPW-lumped components in low-cost photoimageable thick film technology is reported. The passive components are developed with impressive measured self-resonance frequency (SRF) of more than 40 GHz. The newly developed inductors are highly miniaturized and measurements in single (2-D) and double layers (3-D) show inductance value from 0.6 nH to as high as 30 nH for one to eight turns, and with SRF >; 40 and 2 GHz, respectively. The quality factor (g) for small value inductors is better than 100 and that for the 30 nH inductor is better than 30. The 30 nH inductor measures only 1.3 mm × 1.3 mm × 0.7 mm and demonstrates highest level of miniaturization in ceramic based multichip module (MCM) technology. Metal-insulator metal capacitors have been designed and modeled, for single and number of pairs of parallel plates employing horizontally, with increased capacitance and high SRF >; 40 GHz. Based on the models developed for the ML lumped components a miniaturized fifth order CPW-based embedded lowpass filter is designed and developed for IF applications with a cut-off frequency of 3.5 GHz. The filter is miniaturized with remarkably low insertion loss of 0.3 dB and stop band attenuation better than 40 dB at 7 GHz. The measured response characteristics are in excellent agreement with the predicted response. This filter represents one of the highest passive component performances ever reported for ceramic-based MCM technology and highly suitable to incorporate in RF module for cost-effective and compact microwave and mm-wave SOP applications.