Abstract
We have been using advanced modeling and simulation, especially first principles methods, as a valuable tool to design microelectronic materials systems. In this presentation, several successful examples will be given to demonstrate how advanced modeling and simulation through first principles have played an important role in materials design, processing, and reliability, and have positioned us far ahead of our competitors in some critical areas where predictive materials modeling and simulation had paid off. In this paper, I will focus on the development of a grain boundary Frenkel pair (GBFP) theory, a virtual design simulation procedure, and their applications in designs of advanced Cu alloy interconnects.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
