Abstract
Evaluation of the thermal mechanical properties of new materials like Cu and low-krequire multiple complementary metrology toolsets. We report two complementary metrology tools that have a potential to rapidly screen new materials through the integration process. The first is an in-situ integrated metrology chamber that simultaneously measures several physical, optical, chemical, and electrical changes during a heat cycle. Complementing these measurements with results from quantitative adhesion testing, based on the modified edge lift off test (MELT) principle, the thermal mechanical properties of new materials can be rapidly screened and evaluated.
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