Advanced materials with low dielectric constant and low coefficient of thermal expansion

Abstract

For recent major low CTE and dielectric material is epoxy resin system, it must add a large amount of filler and flame retardant to decrease CTE value, Dk, and achieve UL-94 V0 standard. In this study, low CTE AI were synthesized by incorporating biphenyl- or naphthalene- type diisocyanate with rigid and symmetrical structure, and then reacted with naphthalene type epoxy forming low CTE resins. The AIE dielectrics possessed excellent thermal property and can pass the UL-94 V0 flammability standards without adding halogen or phosphorous flame retardants. Moreover, TM-AIE@SiO2 has low dielectric constant that Dk is 2.8@10GHz. The green dielectrics with Tg (> 200°), good dielectric and thermal properties, low CTE (X,Y-axis(a1) is 4 ppm/°C,), and can pass the UL-94 V0 flammability standard. This novel insulated material is very fantastic and compatible with the environment to meet WEEE/RoHS regulations. Therefore, various potential applications can be applied to HDI board, IC substrate, automobile, server board and so on.