Abstract
The ongoing miniaturization as well as advances in packaging technology paves the way to more powerful, intelligent and complex electronic systems, which are used in many applications. Furthermore new ideas to apply modern manufacturing technology enable new sensor concepts. This paper summarizes the work of the Fraunhofer IIS in the field of design of electronic systems. Current challenges of design for manufacturability and reliability as well as design of highly complex systems are discussed and directions are given for exploitation of the advantages in manufacturing technology.
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