Abstract

In this chapter, several important advanced ESD protection design concepts are discussed. Modem mixed-signal and RF ICs require wide-angle considerations in ESD protection circuit design. The ESD-circuit interaction becomes an inevitable and critical issue in chip-level ESD protection design. The ESD-to-circuit influence must be considered in chip designs. Circuit malfunction due to possible accidental triggering of ESD protection structures caused by super fast RF signals emerges as a real problem. Although partial ESD protection is still acceptable in current practices, ESD protection design really desires a full-chip consideration. Basic ESD protection concepts, such as creating conducting paths, low-impedance discharging and low-voltage clamping are the basis for whole-chip ESD protection design. Finally, ESD protection design is typically applicationspecific. No portability shall be assumed in ESD protection circuit design even within the same process technology.

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