Abstract
The adsorption behaviour of poly(ethylene glycol) (PEG), used during copper electrodeposition was investigated by using a microfluidic device for electrochemical analysis. First, the effective surface coverage ratio (θEFF) of the electrodes was obtained based on a model in which the current-density transition curve relates to the θEFF of PEG. Then, PEG concentration (cPEG) and average flow velocity (u) dependency of θEFF were evaluated. The θEFF increased with increasing cPEG and then reached saturation at 0.65 when the cPEG exceeded 200 ppm. The θEFF was independent of u; however, the time to reach saturation decreased with decreasing u.
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