Abstract
It was carried out the synthesis of the Cu(II) ionic imprinted polymer (Cu(II)-IIP) material of amino-silica hybrid via sol-gel process using a tetraethyl-orthosilicate precursor and an active compound 3-aminopropyltrimetoxyslane. Adsorption process of Cu(II) ion on non-imprinted ionic (NIP) material and Cu(II)-IIP follows pseudo-first-order kinetics model with the value of adsorption rate constants (k1) 0.030 and 0.058 L/min and Langmuir adsorption isotherm with the value of adsorption capacity 29.556 and 71.400 mg/g, respectively. Adsorption competition data in ion pair solution of Cu(II)/Ag(I), Cu(II)/Zn(II), Cu(II)/Ni(II), and Cu(II)/Cd(II) showed that the Cu(II)-IIP adsorbent was more selective than NIP with value of selectivity coefficient (α) > 1. A tendency of metal ion adsorbed in multi-metal solution follows this order: Ca(II) < Cd(II) < Ni(II) < Zn(II) < Ag(I) < Cu(II). The Cu(II)-IIP is stable chemically and it can be reused for adsorption of Cu(II) ion in solution without reduction of its capacity.
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