Adhesives and compounds in manufacture of electronic mechanisms

Abstract

The general properties of adhesives and compounds for electronic articles are described that were elaborated by the company: TK-1 adhesive with elevated thermal conductivity; TEK-type adhesives that demonstrate higher elasticity and adhesion ability; TK-8-type all-purpose adhesives; MS-type, single-packed, thermally stable glues for long storage; electrically conductive adhesives; TPK-1 and TPK-2 magnetic adhesives and TPK-3 nonmagnetic adhesive; and some compounds, e.g., epoxide molding compositions. The functionality of all adhesives and compounds presented were tested for weather factors, including elevated humidity, higher and lower temperatures, thermal cycles, effects of vibrations for both pilot samples, and final articles of electronic mechanisms.