Abstract
This study explores the deposition of copper (Cu) films onto colorless polyimides (PIs) using the High Power Impulse Magnetron Sputtering (HiPIMS) technique. The impact of varying operating duty cycles and frequencies on sheet resistance, the deposition rate of Cu films, and the adhesion strength between Cu and PI is examined. Adjusting the HiPIMS parameters aims to achieve superior film quality with reduced sheet resistance. Furthermore, post-thermal treatment significantly improves the adhesion of the Cu layer to the PI substrate due to the mechanical interlocking mechanism created by the surface roughness of the PI and the chemical bonding between the two components.
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