Abstract
AbstractThe blister test is applied to the type of thin‐film structures used in microelectronic packaging. The main advantage of this test is that most of the energy expended is responsible for interfacial fracture, allowing the determination of a fracture energy that closely represents the true interfacial adhesion strength between a thin film and a rigid substrate. It has been proved quantitatively that surface modification contributes to enhanced adhesion. It is found that the critical pressure at which debonding occurs does not correlate with the fracture energy measured in the blister test. Reproducibility of the fracture energy is exceptionally good and allows determination of the optimal thermal condition for promoting adhesion of polyimide on silicon surfaces.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
