Abstract
ABSTRACTThe effects of RF plasma precleaning and polyimide curing conditions on the peel strength have been studied. polyimide precursors of BG-2480 (Toray) and PI-2611 (Du Pont) were spincoated and cured under the various conditions. Cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-2%Si or Al-0.5%Cu-1%Si thin films were deposited onto polyimide substrates using DC magnetron sputtering.The peel strength was enhanced by RF plasma treatment. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing condition strongly affects the peel strength in the Al/modified PI system.
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