Abstract
It has been extremely difficult for nanodiamond composite (NDC) films to be deposited on Ti due to a large thermal expansion coefficient difference. The native oxide layer on Ti is another problem preventing the appropriate adhesion of NDC films and subsequent delamination. In this work, innovative room temperature adhesion of 3 μm NDC films with 54 GPa hardness on Ti substrates was accomplished via a hybrid system of ion etching gun and coaxial arc plasma deposition (CAPD). Ar+ plasma etching is capable to terminate the superficial TiO2 layer and manipulates substrate morphology during CAPD provides instantaneous deposition of NDC films at room temperature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
