Abstract
ABSTRACTEnhanccd adhesion of Copper to spin-coated polytetrafluoroethylene PTFE.) film is achieved by employing an intermediate adhesive layer consisting of fluorinated ethylenepropylene (FEP) and metallic titanium. The peel strength of Cu on PTFE is low (1–2 g/mm) without the adhesive layer. After incorporating the Ti/FEP adhesive layer, a peel strength as high as 80 g/mm can be achieved. The overall peel strength is found to increase with the adhesive layer thickness. Thermal annealing at high temperatures strongly affects its overall peel strength. Previous XPS study indicated the formation of TiCx at the Ti/FEP and Ti/PTFE interfaces. Rutherford backscattering spectrometry and cross-sectional transmission electron microscopy studies revealed that significant amount of Cu diffused into the FEP layer through the Ti layer when the specimens were heat treated at 375°C for various amount of time. Cu diffusion strongly affects the interfacial properties and hence results in the variation of overall peel strength. The results indicate that the thickness of Ti barrier as well as the heat treatment temperature are important for retaining the high peel strength.
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