Abstract
In the ultraviolet nanoimprint lithography (UV-NIL) process, the surface interactionbetween the mold and the resist is essential along with molecularly clean separation ofthe mold from the surface of the cured resist for repeated use of the mold. Inour present study, various mold–resin combinations have been examined by atensile strength method to determine the adhesion force between a mold with arelief pattern and a photocurable resin. The adhesion force of polymer moldsof the fluorine-containing polymers perfluoropolyether dimethacrylate (PFPE)and polydimethylsiloxane (PDMS) were compared to those of hard molds suchas Si and quartz against several commercial UV-NIL resins. Eventually, PFPEwith higher molecular weight—AMONIL—was found to be an excellent UV-NILmold–resin combination with the lowest adhesion force per unit area (20 kPa). Inparticular, the 36-fold repeated imprinting with a high molecular weight PFPE moldshowed only a slight increase of adhesion force by 36 kPa with molecularly cleanrelease from the AMONIL resin, whereas a surface-modified PDMS mold revealedhighly increased adhesion from an initial 20 kPa to 120 kPa after repeated use.
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